At Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
We are seeking a Microelectronics Research & Development Investigators (Senior or Principal) to work in either Fairfax, VA, Annapolis Junction, MD, or Huntington Beach, CA. This position will require about 10% travel.
The Microelectronics Research & Development Investigator (Senior or Principal) will lead the execution of programs, work with other scientist and engineers to define requirements, help develop technical roadmaps and enable technology transitions to programs/products, and to identify, shape and define technical gaps and opportunities for microelectronics Research & Development (R&D). The successful candidate will accomplish this by leveraging their deep knowledge of system engineering, IC design expertise in digital, analog, mixed signal, RF/MMIC or photonics domains, microelectronics packaging and test of complex SoCs in a fast-paced Research & Development environment.
Our teams are currently hiring for a broad range of experience levels including; Senior or Principal Level Microelectronics Research & Development Investigators.
We are Boeing Research & Technology (BR&T): Boeing’s global research and development team creating and implementing innovative technologies that make the impossible possible and enabling the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators; Join us and put your passion, determination, and skill to work building the future! #TheFutureIsBuiltHere #ChangeTheWorld
Within BR&T, Boeing’s Solid-State Electronics Development organization (SSED) performs microelectronics technology development, research, design, characterization and prototyping for such systems. We develop digital, analog, and RF ICs and Systems on Chip (SoCs) for wide variety of application from communications, radar, and navigation to multi-core processors and computing systems. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs are implemented with state-of-the-art semiconductor process technologies including CMOS, SiGe, GaN, and GaAs. SSED works with foundries for the fabrication of the designs but performs design (simulations, emulations, architecture, RTL, synthesis, circuits, physical design, verification), test and characterization in house.
@Boeing, we innovate and collaborate to make the world a better place. From the seabed to outer space, you can contribute to work that matters with a company where diversity, equity and inclusion are shared values. We’re committed to fostering an environment for every teammate that’s welcoming, respectful and inclusive, with great opportunity for professional growth. Find your future with us.
Technically lead execution of microelectronics Research & Development programs, in collaboration with other engineers in the team and SSED portfolio managers and program managers
Participate in development of SSED strategies and roadmaps – technical and business (e.g. new technology areas, partnerships, make/buy trades)
Actively engage and regularly meet with customers (external & internal, current & prospective) and partners to shape SSED business opportunities by identifying and understanding the technical needs, budget requirements, and roadmaps and connecting SSED capabilities, accomplishments, and roadmaps with customers & partners
Prepare technical presentation and briefing them to customers, partners and technical leadership teams
Lead development of detailed technical approaches for affordable microelectronics Research & Development programs
Lead development and delivery of white papers / ROMs and proposals to customers, writing invention disclosures and publishing papers
Collaborate with SSED functional management, portfolio management, and lab management to define and secure the resources needed to execute microelectronics Research & Development programs (e.g. personnel, facilities, software, laboratory equipment)
Regularly present technical findings to customers and their technical advisors
Collaborate with customers to re-vector execution plans based on technical learning and evolving constraints, risks, and opportunities
Collaborate with transition partners (internal & external) to develop and execute transition plans for successful adoption and integration of SSED-developed microelectronics technologies within partner organizations
Mentor junior engineers on technical and program leadership.
Foster a culture of importing best technical and leadership practices
This position is hybrid. This means that the selected candidate will be required to perform some work onsite at one of the listed location options. This is at the hiring team’s discretion and could potentially change in the future.
This position requires the ability to obtain a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim and/or final U.S. Secret Clearance Post-Start is required.
Basic Qualifications (Required Skills/Experience):
Bachelor, Master or Doctorate degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry
5 + years of experience with the development of microelectronics and/or enabling techniques
3+ years of experience in ECAD tools (Microwave office, ADS, Ansys HFSS, etc)
Experience as a Principle Investigator on a government contract program
Preferred Qualifications (Desired Skills/Experience):
10+ years’ related work experience or an equivalent combination of education and experience
Active security clearance
Demonstrated track record as a high performer
Experience developing microelectronics (and/or enabling technologies) for military/aerospace applications focused on frontend or backend design, engineering, test and characterization
Experience working on large-scale ASIC/SoC/RFIC/MMIC design teams
Experience on module/sub-module design, analysis, test and integration
Experience with packaging and prototyping including signal/power integrity and EM and thermal management
Experience supporting military radar, communications, electronic warfare, or avionics/mission processor programs
Experience with photonics integrated circuit design, engineering, test and characterization
Experience with laboratory equipment for testing microelectronics
Experience developing digital ASICs and SoCs in state-of-the-art semiconductor fabrication processes (e.g. 7/10/12/14/16nm FinFET CMOS, 22nm FDSOI CMOS)
Experience developing system and component requirement for RF/MMIC, analog/mixed-signal ICs in CMOS, SiGe, GaN or GaAs technologies for phase array systems or applications in COMM, radar, and EW
Fluency with microelectronics EDA simulation tools is required (e.g. CADENCE, ADS, MWO, SYNOPSYS)
Typical Education & Experience:
Senior (Level 5)
Bachelor’s degree typically 14 or more years’ experience in an engineering classification or a Master’s degree with typically 12 or more years’ experience in an engineering classification or a PhD degree with typically 9 or more years’ experience in an engineering classification. Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard.
Principal (Level 6)
Bachelor’s degree and typically 20 or more years’ experience in an engineering classification or a Master’s degree with typically 18 or more years’ experience in an engineering classification or a PhD degree with typically 15 or more years’ experience in an engineering classification. Bachelor, Master or Doctorate of Science degree from an accredited course of study, in engineering, computer science, mathematics, physics or chemistry. ABET is the preferred, although not required, accreditation standard
This position offers relocation based on candidate eligibility.
Drug Free Workplace:
Boeing is a Drug Free Workplace where post offer applicants and employees are subject to testing for marijuana, cocaine, opioids, amphetamines, PCP, and alcohol when criteria is met as outlined in our policies.
Shift Work Statement:
This position is for 1st shift.
At Boeing, we strive to deliver a Total Rewards package that will attract, engage and retain the top talent. Elements of the Total Rewards package include competitive base pay and variable compensation opportunities.
The Boeing Company also provides eligible employees with an opportunity to enroll in a variety of benefit programs, generally including health insurance, flexible spending accounts, health savings accounts, retirement savings plans, life and disability insurance programs, and a number of programs that provide for both paid and unpaid time away from work.
The specific programs and options available to any given employee may vary depending on eligibility factors such as geographic location, date of hire, and the applicability of collective bargaining agreements.
Please note that the salary information shown below is a general guideline only. Salaries are based upon candidate experience and qualifications, as well as market and business considerations.
Summary pay range: $186,000 – $255,000
Export Control Requirements: U.S. Government Export Control Status: This position must meet export control compliance requirements. To meet export control compliance requirements, a “U.S. Person” as defined by 22 C.F.R. §120.15 is required. “U.S. Person” includes U.S. Citizen, lawful permanent resident, refugee, or asylee.
Export Control Details: US based job, US Person required
Equal Opportunity Employer:
Boeing is an Equal Opportunity Employer. Employment decisions are made without regard to race, color, religion, national origin, gender, sexual orientation, gender identity, age, physical or mental disability, genetic factors, military/veteran status or other characteristics protected by law.